Solder-free power module

Semikron has introduced an intelligent power module for solder-free assembly.

The Miniskiip IPM has been developed for motor power up to 15 kW and has a latch-up free SOI driver IC for reliable driving already integrated. The module has a low thermal resistance of 0.95 kW and a high junction temperature of +175°C.

Power, control and auxiliary contacts are connected directly to the printed circuit board via springs, not solder joints. The elimination of any solder connections results in a higher quality of the assembly.

With snap-on mounting with one standard screw an assembly of module, printed circuit board and heat sink is achieved.

A high-voltage driver IC with a level shifter technology is integrated into the 600 V converter-inverter-brake IPM and the 1200 V inverter (five pack) Miniskiip IPM providing IGBT driving without an optocoupler.

The SOI technology provides latch-up immunity since all switches are dielectrically insulated. A down-level shifter for each channel allows negative secondary offset voltages.

The integrated gate driver remains fully operational for any applied offset down to -50 V. The gate driver IC has an overcurrent circuit protection using an external shunt resistor in the ground plane.

A shut-down can also be forced by the system controller using the shut-down input. Cross-conductions are prevented by the interlock logic.