Single-board computer

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MEN's single-board computer F19P is said to be the first Intel CPU board that is based on the CompactPCI PlusIO standard. The additional serial functions on the J2 rear I/O connector are claimed to make this device flexible and versatile.

MEN's F19P is the first of a new generation of 3U single-board computers. Based on the known CompactPCI (PICMG 2.0), CompactPCI PlusIO (PICMG 2.30) delivers the migration path to the serial CompactPCI Plus standard and can be used both in traditional CompactPCI systems and in hybrid systems with CompactPCI Plus.

Equipped with Core 2 Duo SP9300 down to the Celeron M722, and with a power dissipation between 5.5 and 25 W, the 32-bit/33-MHz board is said to have been developed for embedded applications to meet performance, reliability and low power dissipation requirements.

The device offers many I/Os. According to the PICMG 2.30 standard, four USB 2.0, four fast SATA/SAS, four PCI Express x1 links as well as one gigabit ethernet are available via the J2 rear I/O connector. In addition, it supports seven PCI Express x1 links for fast communication, three for onboard ethernet and four x1 or one x4 links via rear I/O or a special side card.

It is backwards compatible to the SBC family F14 to F18: graphics via VGA, two gigabit ethernet and two USB 2.0 are available on the board front. Additional functions like digital video inputs via DVI, a multitude of UARTs, USBs, SATA or HD audio can be used via the connection of special extension cards.

Being equipped with the new fast DDR3 DRAM which is soldered against shock and vibration, with a robust CompactFlash and a MicroSD card, the board offers nearly unlimited space for application data.

Different watchdogs for monitoring the processor and board temperature complete the functionality, which is supplied with board support packages for Windows, Linux and VxWorks.

Due to the graphics controller, it is especially suitable for applications with high graphics requirements but also as a monitoring or control computer or for testing or measuring.

With its specially developed heat sink and the soldered components to meet shock and vibration requirements it can also be integrated into mobile applications. In addition, all components are prepared for coating against dust and humidity.