Micron NAND and NOR Flash MCP portfolio

Micron Technology’s MCP portfolio combines high-performance, low-power Flash and DRAM into various density combinations, all packaged in ultra-small solutions to save board space and enable users to design optimum products. The company offers a wide range of technologies for users requiring industrial temperatures (-40 to +85°C), automotive-grade capabilities or more than five years of product longevity.

The company’s MCPs combine both the critical non-volatile and volatile memory components needed for an application to function and operate. The non-volatile memory, either NAND or Parallel NOR Flash, is used for the critical boot, OS and application code storage. The volatile memory, consisting of either low-power DRAM (LPDRAM) or pseudo-SRAM (PSRAM), is used for temporary storage, working memory and high-speed operation. High-density NAND-based MCPs enable store-and-download (SnD) operation where code is shadowed into DRAM for data-intensive applications, while lower-density NOR-based MCPs enable fast execute-in-place (XiP) operation for enhanced boot-up performance and longer battery life.

Each MCP comes in scalable package sizes which provide small, low-pin count form factors that can simplify space-constrained applications. By combining the common address and data pins of the Flash and DRAM, the MCPs reduce the overall package ball count and required board space.