esmo group has launched lykos, a modular burn-in board (BIB) loading and unloading system designed to eliminate manual placement and orientation errors. With high demand for microchips, the industry needs an efficient way to manage the volume and turnaround time during burn-in, a process to detect early failures in semiconductor devices. Manual burn-in methods — including hand placement, manual flipping and manual stacking — can be slow, error-prone and risk damaging delicate wafers, leading to downtime and product defects.
lykos, a portable device handling system, offers users modular machine configuration and options that can meet specific requirements and applications. Featuring ergonomic control panels and user-friendly software, the system eliminates the need for manual placement and orientation. With its advanced automation capabilities, lykos is designed to enhance operational efficiency, reduce manufacturing defects and accelerate production cycles. The loader/unloader can be integrated with existing production lines and customised to meet specific requirements.
The lykos features fully automated open top sockets (OTS) loading, flexible BIB clamping for different sizes and a conversion time of less than three minutes, including BIB change. The loader/unloader also features device pin1 orientation in BIB and is designed to handle devices up to 1x1 mm. The device features a 4+1-axis portal pick-and-place robot system with ±0.05 mm accuracy and an integrated camera for pick-and-place position teaching. The loader/unloader also comes with optional positioning vision system, ioniser, vacuum generator and signal light tower systems.
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