congatec conga-TC570r COM Express Type 6 computer-on-modules

congatec has introduced the conga-TC570r 11th Gen Intel Core processor-based computer-on-modules with soldered RAM for high shock and vibration resistance. Designed to withstand extreme temperatures ranging from -40 to +85°C, the COM Express Type 6 computer-on-modules provide full compliance for shock- and vibration-resistant operation in challenging transportation and mobility applications. For more price-sensitive applications, congatec also offers an Intel Celeron processor-based variant for the extended temperature range of 0 to 60°C.

Typical users for the computer-on-modules based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications in challenging outdoor and off-road environments. Shock- and vibration-resistant stationary devices are another important application area as digitisation requires critical infrastructure protection (CIP) against earthquakes and other mission-critical events. All these applications should benefit from superfast LPDDR4X RAM with up to 4266 MT/s and in-band error-correcting code (IBECC) for single failure tolerance and high data transmission quality in EMI critical environments.

Based on the low-power, high-density 11th Gen Intel Core SoCs, the modules offer greater CPU performance and nearly 3x higher GPU performance compared to their predecessors, along with state-of-the-art PCIe Gen4 support. Demanding graphics and compute workloads benefit from up to four cores, eight threads and up to 96 graphics execution units for massive parallel processing throughput in an ultrarugged shape. The integrated graphics not only supports 8k displays or 4x 4k, it can also be used as parallel processing unit for convolutional neural networks (CNN) or as an AI and deep learning accelerator. The CPU-integrated Intel AVX-512 instruction unit with support for vector neural network instructions (VNNI) is another feature accelerating AI applications.

The TDP is scalable from 12 to 28 W, enabling fully sealed system designs with passive cooling only. The high performance of the ultrarugged module has been made available in a real-time capable design including support for time-sensitive networking (TSN), Time Coordinated Computing (TCC) and RTS Realtime Systems’ hypervisor for virtual machine deployments and workload consolidation in edge computing scenarios.