ADLINK Technology has launched the OSM-MTK510, an open standard module (OSM) R1.1 Size-L with a 662 BGA module powered by the MediaTek Genio 510 series processor. The product is designed for efficiency, with a comprehensive AI workload for real-time decision-making and complex data processing.
The module is anchored by a 6-core CPU with 2x Arm Cortex-A78 for demanding tasks and 4x Arm Cortex-A55 for ultralow power consumption, consuming less than 5 W, alongside the MediaTek DLA+VPU AI engine, delivering up to 3.2 TOPS to accelerate AI computations that enable real-time intelligent decision-making.
With its integrated neural processing unit (NPU), the module drives fast AI model inference and streamlines machine learning tasks. It also features up to 8 GB LPDDR4 RAM and 128 GB eMMC to support efficient processing and storage for large datasets and computational AI tasks.
The module’s graphics offer 4K support and a variety of video output options, including HDMI/DP, eDP and DSI. It also includes 1x GbE, USB 3.0, USB 2.0, I2S audio codec interface and 17x GPIOs, to enable portability into various applications.
Its rugged design optionally supports operating temperatures from -40 to 85°C, suitable for extreme and high-vibration environments. The OSM form factor is a compact computer-on-module designed for solderable BGA mini modules, supporting both ARM and x86 designs. At 45 x 45 mm, the OSM Size-L modules offer high performance in a compact form factor.
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