ADLINK COM-HPC-sIDH and Express-ID7 computer-on-modules

ADLINK Technology introduces its latest Intel Xeon D-based computer-on-modules (COMs), available in two form factors: COM-HPC server type and COM Express Type 7. The COMs feature integrated high-speed Ethernet, up to 8x 10G or above with up to 32 PCIe Gen4 lanes, and cutting-edge AI acceleration, while exhibiting extended temperature ratings for embedded and rugged applications.

The COM-HPC-sIDH is a COM-HPC server type D size module powered by Intel Xeon D-2700 HCC processor with up to 20 CPU cores, 30 MB cache, 512 GB DDR4 memory capacity, 8x 10G or 4x 25G Ethernet, and power consumption of 65 to 118 W. It additionally offers a module management controller (MMC) featuring an IPMB interface and a dedicated PCIe-BMC lane. In conjunction with carrier BMC, it provides users with convenient remote management functions such as serial over LAN (SOL) and iKVM.

The Express-ID7 meanwhile is a COM Express Type 7 module based on Intel Xeon D-1700 LCC processor and delivers a power envelope of up to 67 W TDP, offering up to 10 CPU cores, 128 GB DDR4 memory capacity and 4x 10G Ethernet.

Featuring Intel Deep Learning Boost (VNNI) and Intel AVX-512 for AI inference processing, the COMs with Intel Ice Lake-D are designed to fulfil on-device machine learning and deep learning processes, transforming machine vision, natural language processing and smart video analytics. In addition, the COMs feature Intel Time Coordinated Computing (TCC) and provide Time-Sensitive Networking (TSN) support — bringing CPU core control and timely synchronisation over networked devices while enabling low-latency, deterministic performance for driving hard-real-time workloads.

Built for edge and rugged AI applications, the COMs can empower system integrators to realise their IoT innovations, from edge networking, unmanned aerial vehicles, autonomous driving and robotic surgery to rugged HPC servers, 5G base stations, automatic drilling, ship management and more.