STMicroelectronics powers 100 million Indian set-top boxes
Semiconductor company STMicroelectronics has shipped its 100 millionth chipset for digital cable and satellite set-top boxes (STBs) in India. According to Ted Grauch, vice president global marketing, consumer product division, STMicroelectronics, “This key milestone highlights ST’s strong engagement in India and the competitiveness of our SoC portfolio.”
ST’s products are recognised in the Indian digital STB market for their quality, performance, reliability and total cost of ownership. With high image quality, the products are said to improve the end-user experience for linear and on-demand pay TV services.
Grauch said ST’s SoC portfolio has been recently expanded with the latest generation of innovative HD and UltraHD devices. The company demonstrated its STB products for HD (Liege3 SoCs) and UltraHD (Cannes/Monaco 4K SoC) markets during Convergence India 2016 this week.
ST’s HD HEVC Liege3 chipsets are said to deliver up to five times the performance compared with previous HD SoC generations and range from the entry-level 3K DMIPS up to 6K DMIPS with embedded GPU. The Liege3 SoC family is composed of satellite variants (STiH337/STiH332), cable-market products (STiH372) and IPTV set-top-box devices (STiH307/STiH302). Bundle solutions are available for connected and personal video recorder (PVR) STBs, reducing the time required for an OEM to deliver an operator product.
Addressing the satellite markets, the STiH337/STiH332 SoCs implement a DVB-S2X demodulation scheme, enabling service operators to leverage compression-efficiency improvements brought by the HEVC technology. This results in the enhancement of S2X spectral efficiency for optimal use of the satellite transponder capacity.
3D semiconductor chip alignment boosts performance
Researchers have developed an ultra-precise method to align 3D semiconductor chips using lasers...
Researchers achieve 8 W output from optical parametric oscillator
Researchers have demonstrated a total output power of 8 W from a high-power mid-infrared cadmium...
"Dualtronic" chip for integrated electronics and photonics
Cornell researchers have developed a dual-sided chip known as a "dualtronic" chip that...