Laser beam scanning partnership
Semiconductor company STMicroelectronics is partnering with MicroVision, a leader in ultraminiature projection display and sensing technology, to develop, sell and market laser beam scanning (LBS) technology.
The companies will cooperate closely on market development efforts that will include joint sales and marketing activities for LBS solutions. In addition to the pico projection and heads-up display (HUD) markets that both companies are currently addressing, ST and MicroVision anticipate targeting emerging markets and applications including virtual and augmented reality (VR, AR), 3D sensing and advanced driver assistance systems (ADAS).
In addition, the companies anticipate exploring options to collaborate on future technology development including a joint LBS product roadmap. This cooperation would combine the process design and manufacturing expertise of ST with the LBS systems and solutions expertise of MicroVision.
“Working with MicroVision, our goal is to build on our matched skills, shared vision and commitment to grow LBS-enabled markets to open up many opportunities for both companies,” said Benedetto Vigna, executive vice president of the Analog and MEMS Group of ST. “This relationship will position ST to pursue all of the growth opportunities for LBS and the complementary power, sensing and control components.”
“Teaming up with ST, a world leader in its field, is important for MicroVision both for ST’s expertise in semiconductor technology and its global customer reach,” said Alexander Tokman, president and CEO of MicroVision. “Combining ST’s expertise in the development and manufacture of key components for LBS scanning engines with MicroVision’s proprietary system, engine and applications knowledge, and intellectual property, can be highly advantageous for marketing LBS solutions to a wide array of companies for numerous applications.”
The companies have an existing working relationship on production of MicroVision components. ST manufactures MicroVision’s current-generation MEMS die based on MicroVision’s design. ST also manufactures one of the ASICs sold by MicroVision.
3D semiconductor chip alignment boosts performance
Researchers have developed an ultra-precise method to align 3D semiconductor chips using lasers...
Researchers achieve 8 W output from optical parametric oscillator
Researchers have demonstrated a total output power of 8 W from a high-power mid-infrared cadmium...
"Dualtronic" chip for integrated electronics and photonics
Cornell researchers have developed a dual-sided chip known as a "dualtronic" chip that...
