Building smaller computer chips with DNA 'origami'


Wednesday, 23 March, 2016

The key to faster, cheaper computer chips could be inside your brain — literally. Researchers are harnessing DNA and using techniques similar to origami to make nanoscale structures that could shrink component sizes.

“We would like to use DNA’s very small size, base-pairing capabilities and ability to self-assemble, and direct it to make nanoscale structures that could be used for electronics,” Adam T Woolley, PhD, said of the research.

The smallest features on chips currently produced by electronics manufacturers are 14 nanometres wide — more than 10 times larger than the diameter of single-stranded DNA, meaning that his genetic material could form the basis for smaller-scale chips.

“The problem, however, is that DNA does not conduct electricity very well,” he said. “So we use the DNA as a scaffold and then assemble other materials on the DNA to form electronics.”

Prototypes for cheaper computer chips are being built with metal-containing DNA origami structures.

Prototypes for cheaper computer chips are being built with metal-containing DNA origami structures. Image credit: Zoie Young, Kenny Lee and Adam Woolley.

Woolley, in collaboration with Robert C Davis, PhD and John N Harb, PhD, at Brigham Young University, is building on other groups’ prior work on DNA origami and DNA nanofabrication.

The most familiar form of DNA is a double helix, which consists of two single strands of DNA. Complementary bases on each strand pair up to connect the two strands, much like rungs on a twisted ladder. But to create a DNA origami structure, researchers begin with a long single strand of DNA. The strand is flexible and floppy, somewhat like a shoelace. Scientists then mix it with many other short strands of DNA — known as ‘staples’ — that use base pairing to pull together and crosslink multiple, specific segments of the long strand to form a desired shape.

However, Woolley’s team isn’t content with merely replicating the flat shapes typically used in traditional two-dimensional circuits. “With two dimensions, you are limited in the density of components you can place on a chip,” Woolley explained. “If you can access the third dimension, you can pack in a lot more components.”

Kenneth Lee, an undergraduate who works with Woolley, has built a 3D, tube-shaped DNA origami structure that sticks up like a smokestack from substrates, such as silicon, that will form the bottom layer of their chip. Lee has been experimenting with attaching additional short strands of DNA to fasten other components such as nano-sized gold particles at specific sites on the inside of the tube. The researchers’ ultimate goal is to place such tubes, and other DNA origami structures, at particular sites on the substrate. The team would also link the structures’ gold nanoparticles with semiconductor nanowires to form a circuit. In essence, the DNA structures serve as girders on which to build an integrated circuit.

Lee is currently testing the characteristics of the tubular DNA. He plans to attach additional components inside the tube, with the eventual aim of forming a semiconductor.

Woolley noted that a conventional chip fabrication facility costs more than $1 billion, in part because the equipment necessary to achieve the minuscule dimensions of chip components is expensive and because the multistep manufacturing process requires hundreds of instruments. In contrast, a facility that harnesses DNA’s knack for self-assembly would likely entail much lower start-up funding.

“Nature works on a large scale, and it is really good at assembling things reliably and efficiently,” he said. “If that could be applied in making circuits for computers, there’s potential for huge cost savings.”

The research was presented at the 251st National Meeting & Exposition of the American Chemical Society (ACS). The research received funding from the Semiconductor Research Corporation.

Related News

3D semiconductor chip alignment boosts performance

Researchers have developed an ultra-precise method to align 3D semiconductor chips using lasers...

Researchers achieve 8 W output from optical parametric oscillator

Researchers have demonstrated a total output power of 8 W from a high-power mid-infrared cadmium...

"Dualtronic" chip for integrated electronics and photonics

Cornell researchers have developed a dual-sided chip known as a "dualtronic" chip that...


  • All content Copyright © 2024 Westwick-Farrow Pty Ltd