STMicroelectronics BALF-SPI2-01D3 single-chip balun for low-power radio

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STMicroelectronics has introduced a matched balun for its S2-LP 868-927 MHz low-power radio transceiver to help engineers save board space and minimise RF-circuit design challenges in size-conscious products like IoT sensors, smart meters, alarms, remotes, building automation and industrial controls.

The 3.26 mm² BALF-SPI2-01D3 integrates all the impedance-matching and filtering components needed to connect an antenna to the S2-LP radio, replacing a conventional network of 16 discrete capacitors and inductors that can occupy up to 100 mm² of board real estate — a footprint reduction of more than 96%.

In addition to saving space, circuit design is simplified, with no need to select component values or tackle exacting layout challenges. Fully optimised for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximise RF performance.

As a critical enabling technology for these highly integrated matching devices, ST’s integrated passive device (IPD) on non-conductive glass-substrate ensures low RF signal losses, with low amplitude and phase imbalances. This is said to result in better RF subsystem performance and longer operating life for battery-powered devices.

For more information: www.st.com/balf-spi2-01d3-news.