ICP DAS IWS-6201-CE7 Windows CE-based PAC
The IWS PAC series is a WinCE 7.0-based InduSoft PAC from ICP DAS. It is claimed to make connectivity for the Internet of Things and mobile devices easy.
The panel PC combines a RISC-based CPU board and TFT LCD touch screen to create a ruggedised flat panel computer for a variety of control and HMI applications. It provides a variety of I/O, including Gigabit Ethernet, USB port, RS232 and RS485.
The operating system is pre-installed in the onboard Flash memory. Remote I/O expansion is available using Ethernet I/O modules, RS485 I/O modules, Wi-Fi and ZigBee wireless I/O modules. Designed for panel mount installation, the front panel is NEMA 4/IP65 rated and can withstand sprayed water, humidity and extreme dust.
The product has a 7″/10.4″/15″ LCD with resolution of 800 x 480/800 x 600/1024 x 768. Operating over a wide -10 to +60°C ambient temperature range, the fanless unit has no moving parts.
Other features include: InduSoft Runtime inside; support for Modbus, OPC, TCP/IP client/server; DCON driver for ICP DAS I/O modules provided; a Cortex-A8 (1 GHz or 720 MHz) CPU; and a resistive touch panel.
Phone: 02 9457 6011
congatec conga-SA8 SMARC modules
congatec has updated its conga-SA8 SMARC modules to include the latest Intel Core 3 processor...
STMicroelectronics ST85MM programmable powerline communication modem
The STMicroelectronics ST85MM programmable powerline communication modem provides a future-proof...
u-blox MAYA-W4 tri-radio module
The u-blox MAYA-W4 tri-radio module is suitable for a range of IoT applications in diverse...