Samtec has released its Micro Backplane Design Guide detailing how the company’s high-speed and high-density board-to-board and panel-and-I/O interface solutions can be used for add-on boards, packaging solutions and for increasing I/O density.
Board-to-board solutions include perpendicular and co-planar applications for high-speed edge card (HSEC8 series) and the company’s two-piece EdgeRate connector system (ERM8/ERF8 series).
High-density solutions are addressed with Searay (SEAM/SEAF series) open pin field arrays, while Q2 integrated ground plane connectors (QMS/QFS series) address traditional power and ground applications within high-speed interconnects.
I/O solutions are shown that can increase panel density and/or achieve I/O flexibility. Coax cable and high-speed flex jumper solutions can route signals from the back of the box to the front panel. They can also be used to bypass traditional backplanes. Samtec’s True75 BNC and micro backplane solutions for 3G SDI broadcast video are also illustrated.
Phone: 03 9512 7747
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