Tieto and STMicroelectronics develop automotive central control units

Semiconductor supplier STMicroelectronics (ST) is collaborating with Tieto, a software and services company and member of the ST Partner Program, to develop central control unit (CCU) software to run on STMicroelectronics’ Telemaco3P platform.

Accelerating electrification and connectivity requirements of vehicles are pushing for greater processing power and cybersecurity. In turn, automakers’ demands for CCUs meeting connectivity, data privacy, security and over-the-air update needs have led ST to develop the Telemaco family of automotive, multi-processor SoCs (systems-on-chips) and its associated Telemaco3P Modular Telematics Platform (MTP), which provides an open development environment for prototyping smart driving applications. The secure and safe Telemaco3P automotive SoC is said to be the industry’s first microprocessor to embed an isolated hardware security module. The module provides safety measures for the implementation of ASIL-B-qualified systems.

Tieto’s Software R&D services division and ST are developing vehicle CCU software and next-generation telematics solutions based on the Telemaco3P platform. Tieto aids customers with system integration as well as design and development of a wide range of secure smart driving applications. These applications will support high-throughput wireless connectivity, over-the-air firmware upgrades and car-to-car communication solutions.

“With ST, we’ll be able to help automotive OEMs and tier 1 vendors get the very most out of ST’s powerful and secure Telemaco3P platform,” said Viet-Anh Pitaval, Head of Automotive Business Development at Tieto. “Together, we intend to accelerate the development of vehicle central control unit software as well as enable tremendous new types of value-adding automotive services.”

“Teaming up with software R&D experts like Tieto enables ST to offer even greater support to automotive customers as they develop and deploy new feature-rich solutions and applications for both in-vehicle processing and car connectivity to the cloud, leading to greater safety and convenience on the roads,” added Luca Rodeschini, General Manager Automotive and Discrete Group Strategy and Automotive Processors Division at STMicroelectronics.

The ST Telemaco3P MTP provides positioning hardware with ST’s automotive-grade multi-constellation GNSS Teseo IC and dead-reckoning sensors. It also offers direct connectivity to automotive buses such as CAN-FD, FlexRay and BroadR-Reach (100Base-T1), as well as to optional modules for Bluetooth, Wi-Fi, LTE and V2X communication.

Together, Tieto and ST will demonstrate a smart V2X Pedestrian Crossing Alert application during CES, the Global Stage for Innovation, held in Las Vegas from 7–10 January 2020.

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