Industry consortium to standardise chiplet ecosystem

Advanced Semiconductor Engineering (ASE), AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and Taiwan Semiconductor Manufacturing Company have announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

The organisation, representing a diverse ecosystem of market segments, will address customer requests for more customisable, package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multivendor ecosystem.

The founding companies also ratified the Universal Chiplet Interconnect Express (UCIe) specification, an open specification that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols and software stack which leverage the well-established PCI Express (PCIe) and Compute Express Link (CXL) industry standards. The specification will be available to UCIe members.

The founding companies represent a wide range of industry expertise and include leading cloud service providers, foundries, system OEMs, silicon IP providers and chip designers, and they are in the process of finalising incorporation as an open standards body. Upon incorporation of the new UCIe industry organisation later this year, member companies will begin work on the next generation of UCIe technology, including defining the chiplet form factor, management, enhanced security and other essential protocols.

To learn more about membership opportunities, contact admin@UCIexpress.org.

Image credit: ©stock.adobe.com/au/Andrii Yalanskyi

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