ElectroneX 2016

ElectroneX, Australia’s only dedicated trade event for the electronics industry, returns to Sydney on 14–15 September at Australian Technology Park. With around 100 exhibitors and a technical conference featuring leading international industry experts, this is truly an event not to be missed.

When: 14–15 September 2016

Where: Australian Technology Park, Sydney

Website: www.electronex.com.au

This year’s event continues to reflect the move towards niche and specialised manufacturing applications in the electronics sector and will also cater for the increasing demand from visitors for contract manufacturing solutions. There is expected to be a record number of exhibitors participating in this year’s event as the industry is seeing an upturn in demand from local manufacturers and specialist applications that are recognising the expertise and quality that is available from Australian-based suppliers.

The event targets electronics design professionals; electronic and electrical engineers and technicians; along with OEM, scientific, IT and communications professionals and service technicians. ElectroneX was launched in 2010 to provide professionals across an array of industry sectors with the opportunity to learn about the latest technology developments for systems integration and production electronics, and the last Sydney show in 2014 attracted over 1000 trade and industry visitors. The SMCBA Electronics Design & Manufacture Conference (founded in 1988) will bring together local and international speakers to share information critical to the successful design and development of leading-edge electronic products and systems engineering solutions. A series of free seminars with overviews on key industry topics will also be held on the show floor throughout the two-day event.

The conference will include the following presentations and the complete conference and seminar program can be found on the show website at www.electronex.com.au.

• Dr S Manian Ramkumar, Director – Center for Electronics Manufacturing and Assembly, Rochester Institute of Technology, will deliver three presentations: Defect Analysis and Process Troubleshooting; Characterising and Minimising Voids in QFN Device Assembly Using Lead Free Solder Alloys; and Root Cause Analysis for Reliability Issues in Electronics Packaging.
• Dale Lee, Plexus Corporation, Staff DFX Process Engineer, will deliver two presentations: DFX Design for Excellence: DFM, DFA, DFT and More; and Flex PCB Design and Assembly.
• Simon Blyth, Director of Engineering, LX Group, will deliver a presentation on the Internet of Things.
• Dr Hamish Laird, ELMG Digital Power, will deliver a presentation on High Performance Digital Control.
• Mark Steiner, Managing Director, Hetech, will deliver a presentation entitled To Design or not to Design a Commercial View to Product Development.