Lintek HDI multilayer printed circuit boards

Thursday, 28 July, 2016 | Supplied by: Lintek Pty Ltd

Lintek HDI multilayer printed circuit boards

Lintek is offering its clients copper-filled ‘via in pad’ technology for BGA devices down to 0.35 mm pitch. The company provides blind, buried and castellated vias on multilayer circuit boards manufactured on a wide variety of dielectrics.

Lintek creates total solutions for the most demanding environments. Its boards are used in a wide range of industries, from cutting-edge military EW systems to amateur electronics projects. The company says it values all clients, no matter what the requirement.

Lintek has IPC-A-600 certified staff and trainer on-site. All PCBs are manufactured to IPC Class 2 minimum. Certification is available on request.

The company is compliant with Quality System AS/NZS ISO 9001:2008. Subject to material and process constraints, it is able to produce boards with Underwriters Laboratories (UL) approval.

Online: www.lintek.com.au
Phone: 02 6299 1988
Related Products

Würth Elektronik WR-CRD Micro SIM card connector

The WR-CRD Micro SIM card connector from Würth Elektronik can be used to equip IoT devices...

SC Manufacturing Solutions M2-900 laser marking system

The M2-900 laser marking system from SC Manufacturing Solutions features four types of lasers...

Interflux SAC305 DP5505 solder paste

The Interflux DP5505 solder paste is designed for a range of applications and offers stability...


  • All content Copyright © 2024 Westwick-Farrow Pty Ltd