Latest Articles

Can AI speed up critical communications chip design?

A team led by researchers from the University of Texas at Austin plans to add AI into the design process for developing high frequency comms chips.

Design 05 June, 2025

Packaging Evolution: 50 years of the isolated power module

Semikron Danfoss has marked the 50th anniversary of the SEMIPACK isolated power module with the launch of SEMIPACK 2, incorporating the latest generation of diode and...

Components 01 June, 2025

Thought Leadership: Insights GPC Electronics

Hawker Richardson's Thought Leadership series presents a conversation with Christopher Janssen, Managing Director of GPC Electronics, to explore the technologies,...

Business 01 June, 2025

Securing Embedded Edge Devices

Implementing embedded edge security through confidentiality, integrity and availability.

Design 01 June, 2025

Petahertz-speed phototransistor built for ambient conditions

Researchers have developed a technique using pulses of light to manipulate electrons in graphene, achieving potential computing speeds in the petahertz range.

Components 29 May, 2025

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Business
Avoiding EMC issues: simple tests you can do yourself

Avoiding EMC issues: simple tests you can do yourself

This is a brief overview of EMC compliance with some practical tips on not getting caught out.

Article 02 May, 2025
Components
Petahertz-speed phototransistor built for ambient conditions

Petahertz-speed phototransistor built for ambient conditions

Researchers have developed a technique using pulses of light to manipulate electrons in graphene, achieving potential computing speeds in the...

Article 29 May, 2025
Data acquisition
Single-step 3D printing method to create tiny robots

Single-step 3D printing method to create tiny robots

The breakthrough enables the mechanical and electronic systems needed to operate a robot to be manufactured all at once.

Article 08 July, 2022
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