Microchip Technology embedded IoT solutions for rapid prototyping

Wednesday, 01 April, 2020 | Supplied by: Microchip Technology Hong Kong Limited

Microchip Technology embedded IoT solutions for rapid prototyping

Due to the fragmented nature of the Internet of Things (IoT) marketplace, increasing project complexity and costs, Microchip Technology says that today’s developers face more challenges in design decisions than ever before. To address these challenges, the company has announced its cloud-agnostic, turnkey, full-stack embedded development solutions.

From small PIC and AVR microcontrollers (MCUs) for sensors and actuator devices, to sophisticated 32-bit MCU and microprocessor (MPU) gateway solutions for edge computing, the company is now making it possible for developers to connect to any major core and any major cloud, using Wi-Fi, Bluetooth or narrowband 5G technologies — all while maintaining a strong security foundation through the support of its Trust Platform for the CryptoAuthentication family.

The PIC-IoT WA and AVR-IoT WA development boards feature a companion custom-built rapid prototyping tool developed in collaboration with Amazon Web Services (AWS), helping designers natively connect IoT sensor nodes to the AWS IoT Core service via Wi-Fi.

Based on the latest wireless system on module (SOM), the ATSAMA5D27-WLSOM1 is a gateway solution running AWS IoT Greengrass. It integrates the SAMA5D2 MPU, WILC3000 Wi-Fi and Bluetooth combo module fully powered by the MCP16502 high-performance power management IC (PMIC).

The SAM-IoT WG connects the Google Cloud IoT Core with Microchip’s 32-bit SAM-D21 Arm Cortex M0+ range of microcontrollers.

The Azure IoT SAM MCU-based IoT development platform integrates the Azure IoT device SDK and Azure IoT services with Microchip’s MPLAB X development tools ecosystem.

The PIC-BLE and AVR-BLE boards for sensor node devices connect to mobile devices for industrial, consumer and security applications and the cloud via gateways featuring Bluetooth Low Energy (BLE).

The LTE-M/NB-IoT development kit features Monarch chip-based modules by Sequans, enabling coverage of IoT nodes and leveraging the latest low-power, 5G cellular technology.

For more information: https://www.microchip.com/design-centers/internet-of-things.

Online: www.microchip.com
Phone: 852 29435100(ext. 5105)
Related Products

ADLINK EMP-100 fanless mini PC

The ADLINK EMP-100 fanless mini PC is an effective digital signage player, suitable for retail...

Axiomtek CEM710 COM Express Type 7 module

The Axiomtek CEM710 COM Express Type 7 module is suitable for embedded edge AI servers, high-end...

Quectel EG91-EX LTE Cat 1 module

The Quectel EG91-EX LTE Cat 1 module is optimised for M2M and IoT applications, and offers data...


  • All content Copyright © 2024 Westwick-Farrow Pty Ltd